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The Strategic Cost Model is now the Strategic Cost and Price Model

 

The Strategic Cost and Price Model - 2020 - revision 02 is now available with data updates and other improvements. BUY NOW!

 

To request a WebEx demo please send us an email.

 

Introduction

The IC Knowledge - Strategic Cost and Price Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade.

 

Specifically the model covers:

- 2D NAND - Kioxia, Micron, Samsung

- 3D NAND - Intel, Intel-Micron, Kioxia, Micron, Samsung, SK Hynix

- 3D XPoint - Intel-Micron

- DRAM: Micron, Samsung, SK Hynix

- Foundry - GLOBALFOUNDRIES, Samsung, TSMC

- IDM Logic - Intel MPU and ST Micro

 

In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.

 

For each target company and process every 300mm fab they have is predefined so that if you just

pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.

 

Supported processes

The Model supports 2D NAND to 14nm, 3D NAND to 512 layers, 3D XPoint to 6 layers, DRAM out 1c, Foundry to 1.75nm, IDM out to 3nm (1.75nm foundry equivalent)

 

Supported wafer sizes

300mm

 

Supported cost elements

Wafer cost and price. No packaging or test.

 

Who should buy this product

The IC Knowledge - Strategic Cost and Price Model - is in use at many IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs.

 

Latest revision updates

 

  • Model - Fixed missing quarters on the 'CostPerQtr' sheet.
  • Processes - Added BSB into the 'NGLBlocks' and 'ProcBlocks' sheets so it is explicitly in the flows and not calculated. Updated 3D NAND introduction dates. Updated EUV doses. Added post carbon strip cleans throughout. Added CMP - C (carbon) and Wet clean - PC (post carbon strip) processes. Updated TSMC 3nm, 2.5nm and 1.75nm process pitches. Updated Intel 7nm pitches.
  • NGL - Rebuilt the 'NGLBlocks' sheet to be more reliable.
  • Equipment - Fixed an error in the Litho tool upgrade calculations. Added EUV specific OEE and asigned to EUV tools. Updated EUV tool throughput values.
  • Materials - Updated MoO2Cl2 usage for 3D NAND word line applications. Added C alumina (CMP slurry).
  • Labor - NA
  • Yield - NA
  • Facilities - Fixed an error in the EUV power calculation and updated the numbers.
  • Fabs - Updated TSMC fab 18 ramp.

 

System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.

 

Model Cost and How to Buy

A single user license allows one user on one computer and is $5,500, an enterprise license allowing an unlimited number of users at a company is $15,000. The model may be purchased at a discount on-line with a credit card here or you may email or fax us a purchase order with 30 day terms. The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.

 

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