IC Cost and Price Model

 

The IC Cost and Price Model - 2022 - revision 05 is now available with a new process, data updates, and a bug fix. BUY NOW!

 

To request a demo copy please send us an email.

 

Introduction

The IC Knowledge - IC Cost and Price Model is the industry standard for cost and price modeling of low power silicon integrated circuits. For high power silicon integrated circuits, discrete devices and compound semiconductors we recommend our Discrete and Power Products Cost and Price Model. The IC Cost and Price model does not cover 3D NAND and only covers DRAM up to the 2x generation, for 3D NAND or 2y and beyond DRAM we recommend our Strategic Cost and Price Model.

 

The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.

 

 

Example of product cost summary

 

Supported processes

The Model supports over 700 processes broken out by company and process node and looking forward one process nodes. See the links in the gray bar at the right for the specific list of processes.

 

Supported wafer sizes

100mm, 125mm, 150mm, 200mm and 300mm.

 

Supported cost elements

Wafer cost, wafer test, packaging and final test.

 

Who should buy this product

The IC Knowledge - IC Cost and Price Model is widely used by IDMs, Fabless companies, Analysts, Consultants, Electronics Systems and Automotive Companies and many others. The model is used for benchmarking, evaluating pricing, market research and many other uses. Our model customers include most of the worlds largest IDMs, Fabless and Electronics Systems companies. For OEMs and Materials companies we recommend our Strategic Cost Model.

 

Current revision updates:

• Overall Model - Updated selected foundry margins.
• Yield - NA
• Depreciation - NA
• Equipment - NA
• Processes - Added TSMC 4nm process.
• Facilities - NA
• Materials - NA
• Labor - NA
• Lookups - NA
• Packaging - Fixed an issue with the 5.6.1. Bond Pads not displaying properly for Wafer Level packaging on the 'Main Selection' sheet. Fixed an issue with the packaging volume not updating the packaging price.
• 1 Test - NA

System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.

 

Related Products

• Assembly and Test Cost and Price Model - calculate the cost and price of most semiconductor assembly and test operations.
• Discrete and Power Products Cost and Price Model - easily calculate the cost and price of most high power silicon integrated circuits and discrete devices.
• Strategic Cost and Price Model - easily project wafer cost, equipment and materials requirements for leading IC producers.