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Microprocessor trends

Year	Product	Process type	Line width (nm)	Transis tors (M)	Mask layers	Cell Construction				Layers		Die size (mm)
Year	Product	Process type	Line width (nm)	Transis tors (M)	Mask layers	Proc/bus (bits)	Clock (MHz)	Voltage (V)	Cache (Kbits)	Poly	Metal	Die size (mm)
1971	4004	PMOS	10K	0.0023	---	4	0.108	12	0	1	1	13.5
1972	8008	PMOS	10K	0.0035	---	8	0.2	12	0	1	1	15.2
1974	8080	NMOS	6,000	0.006	---	8	2	12	0	1	1	20.0
1976	8085	NMOS	3,000	0.0065	---	8	0.37	5	0	1	1	20.0
1978	8086	NMOS	3,000	0.029	---	16	5-10	5	0	1	1	28.6
1979	8088	NMOS	3,000	0.029	---	16/8	5-8	5	0	1	1	28.6
1982	80286	CMOS	1,500	0.134	12	16	6-12	5	0	1	2	68.7
1985	80386DX	CMOS	1,500	0.275	12	32	16-33	5	0	1	2	104
1989	80486DX	CMOS	1,000	1.2	12	32	25-50	5	0	1	3	163
1992	80486DX2	BiCMOS	800	1.2	20	32	50-66	5	0	1	3	81
1993	Pentium	BiCMOS	800	3.1	20	32/64	60-66	5	0	1	3Al	264
1994	80486DX4	BiCMOS	600	1.6	22	32	75-100	5	0	1	3Al
1995	Pentium Pro	BiCMOS	350	5.5	20	32/64	150-200	3.3	0	1	4Al	310
1997	Pentium II	CMOS	350	7.5	16	32/64	233-300	2.8	0	1	4Al	209
1998	Celeron	CMOS	250	19	19	32/64	300-333	---	128	1	5Al	-
1999	Pentium III	CMOS	180	28	21	32/64	500-733	1.65	256	1	6Al	140
2000	Pentium 4	CMOS	180	42	21	32/64	1,400-2,000	1.7	256	1	6Al	224
2001	Pentium 4	CMOS	130	55	23	32/64	2,000-2,200	1.5	512	1	6Cu	146
2001	Itanium	CMOS	180	25	21	64/64	733-800	-	96	1	6Al	-
2002	Pentium 4	CMOS	130	55	26	32/64	2,000-3,000	1.5	512	1	6Cu	131
2002	Itanium II	CMOS	130	220	26	64/64	900-1,000	-	256/1,500	1	6Al	421
2003	Pentium 4	CMOS	90	>55	29	32/64	2,800 - 3,800	1.2	>512	1	7Cu	-
2006	Core 2	CMOS	65	291	31	32/64	1,800 - 2,930		4,096	1	8Cu	143
2007	Core 2 (Penryn)	CMOS	45	410	35	32/64	>1,860		6,144	1	9Cu	107

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