IC Knowledge - IC Technology Report

2008 IC Technology Report
The 2008 IC Technology report is now available. Released April 29, 2008 the report is 331 pages long with 328 full color figures and 46 tables. BUY NOW!

Download sample chapter 5 from the 2006 report or email us for the free DRAM chapter from the 2008 report..

Introduction
Who should buy this product
Chapter list
How to order and cost

Introduction
The 2008 IC Technology report is a complete update of the 2007 IC Technology report. All of the material has been reviewed and updated where needed. The report has 22 chapters organized into 4 major sections. The first section is introductory material to prepare for the later sections. The second section presents the unit process steps such as; wafer cleaning, photolithography, implant, CMP and more. The third section covers; process integration and includes Intel's 45nm microprocessor flow as well as state-of-the-art DRAM and Flash flows. The fourth section covers materials. Written to be easy to understand, the report is in full color and includes a large number of illustrations.
Published April 29, 2008 Number of pages 328 Number of figures 336 Number of tables 46

Who should buy this report
Anyone who needs to stay current on the state-of-the-art in IC processing should read this report. Marketing managers and technologists at equipment manufacturers, IC company and fabless design house purchasing managers, designers, executives at IC companies or companies that supply the IC industry, engineers and technicians that need a broad and current overview and many others.
Chapter List
The following is the 2008 IC Technology report chapter list. Comments about updates made to each chapter versus the 2007 report are in bold. 2008 Table of contents.

Chapter 1 - Welcome - updated product and chapter list.
Chapter 2 - Moore's law: the industry driver - updated graphs to include 2007 data.
Chapter 3 - Introduction to integrated circuit devices - updated market by technology graph.
Chapter 4 - Integrated circuit manufacturing overview - updated packaging graph for 2007 data.
Chapter 5 - Wafer cleaning and stripping- added new wet strip and dry clean processes. Added a discussion of 45nm and 32nm critical cleaning and stripping issues.
Chapter 6 - Photolithography - Expanded coverage of excimer lasers, updated and expanded immersion lithography coverage. Updated and expanded coverage of high index immersion. Expanded coverage of double patterning. Updated coverage of EUV. Updated lithography roadmap and added cost per step for dry, wet and wet double patterning comparison.
Chapter 7 - Etching - expanded discussion on 45nm and 32nm etching requirements including double patterning.
Chapter 8 - Ion Implantation and annealing - reviewed and updated.
Chapter 9 - Dielectric deposition - reviewed and updated.
Chapter 10 - Metallization - reviewed and updated. Added ultrasonic agitation of plating baths and table of metal CVD reactions.
Chapter 11 - Chemical mechanical planarization - reviewed and updated
Chapter 12 - CMOS process integration - reviewed and updated
Chapter 13 - CMOS technology trends - reviewed and updated
Chapter 14 - 45nm CMOS logic process flow - Intel's 45nm process flow with step by step cross sections
Chapter 15 - Projected 32nm CMOS logic process - a discussion of issues for 32nm
Chapter 16 - Sub 32nm devices - reviewed and updated
Chapter 17 - DRAM capacitors - added MESH capacitors, recessed array transitors and discussion of the Qimonda switch to stacked capacitors - email us to get this chapter for free
Chapter 18 - Flash memory - added information on Toshiba and reviewed and updated all other data
Chapter 19 - Silicon Germanium - reviewed and updated
Chapter 20 - Substrates - reviewed and updated
Chapter 21 - Low-k dielectric - reviewed and updated
Chapter 22 - High-k dielectric - reviewed and updated

How to order and cost
The full report is now available delivered as an Adobe Acrobat file. Pricing is: 1st copy - $1,050 2nd or 3rd copy or upgrade - $700 4th copy - $560 Site licence - $3,570 Order Now!

Published	April 29, 2008
Number of pages	328
Number of figures	336
Number of tables	46