IC Knowledge - IC Cost Model

Introduction
The IC Knowledge - IC Cost Model is designed to enable users to easily estimate manufacturing costs for most IC's. The cost model runs inside of Excel, the user makes selections from drop-down menus on 2 worksheets covering wafer and product cost. The user must make 7 selections many of which have lookup help available, there are 66 additional selections available on the default sheet that may be overriden if desired to fine tune the model and the process may now be fined tuned to add and subtract individual process steps. All of the defaults are technology specific and in most cases will not need to be changed. There are 8 output sheets that provide a detailed breakout of costs. The model also includes a calculator for stacked die - multi-chip packages.

Who should buy this product

This product is designed to serve the needs of anyone interested in understanding the manufacturing costs of integrated circuits and who also wants detail on the wafer fabrication costs section.
Do you:

Purchase ICs and want to know what it really costs your supplier to make the ICs?
Market ICs and want to know what your competitors products cost?
Market equipment and want to understand how equipment costs impact IC costs?
Manage an IC manufacturing operation and want to benchmark your company against others?
Follow IC companies stocks and want to know what particular products cost them to make?
Develop new products and want to understand the cost impact of process decisions.
Work at a Fabless IC company and want to know what it costs your suppliers to make wafers for you?

If you answered yes to any of the question above, then this product is for you.

What is different for 2008 versus the 2007 model
For the 2008 model all of the underlying model data has been reviewed and in many cases updated. Specifically direct and indirect labor rates, packaging and starting wafer costs have been updated. The 2008 model also has several new processes more new processes planned to be added as the year progresses.

How to get more information about the model
We provide several tools to better understand the model before purchasing it.

Email us to get a demo copy of the model.
Applications notes detail the processes and packages supported, there are also several applications notes from the 2001 and 2002 models that although the model has changed and they don't specifically apply are still useful in a general sense. Application notes may be down loaded from the support page.
Process and package type lists.

If none of these tools answers your questions, please feel free to E-mail us at info@icknowledge.com

Revision history

The following is the revision history for the 2008 IC Cost Model:

Revision 0800 - Updated direct labor costs, indirect labor costs, starting wafer costs and packaging costs. Adjusted Fab capacity for some NXP processes and changed Philips to NXP. Updated Intel processes based on the latest announcements and analysis. Added Freescale SMOS5 (800nm), SMOS7(350nm) and SMOS8(250nm) processes. Added STMicro BCD6 (350nm) with 3, 4 and 5 layer metal and BCD8 (180nm) with 4, 5 and 6 layer metal processes. Updated TSMC 45nm processes based on latest information. Adjusted TSMC 65nm processes. Changed range of years available for modeling to 2007 to 2015 versus the old range of 2004 to 2012.
Revision 0800a - Fixed a bug in the test cost calculation. Added a description of the package types into the package type help pop-up. Adjusted default number of upgrades for 45nm processes. Adjusted Flash memory defect densities. Added Samsung 80nm - 1Gb DRAM die size.
Revision 0800b - Added Samsung 51nm and 40nm NAND Flash processes. Added Freescale 65nm process.
Revision 0801 - Added TSMC 500nm and 350nm processes. Adjusted foundry margins. Fixed a bug in the electric cost calculation. Added Toshiba 250nm, 170nm, 56nm and 43nm NAND Flash processes and adjusted Fab capacities for all Toshiba NAND Flash processes. Expanded Fab capacity to allow capacities up to 250,000 WPM. Added calculation of advanced material costs for high-k and dual metal gate. Updated critical lithography tool costs for sub 65nm. Fixed number of process steps displayed on the '2 wafer cost' sheet to include metrology steps. Changed critical lithography tool calculation for sub 65nm to take into account companies that do and don't use immersion lithography. Added the ability to have an equipment set come on-line part way into the year and changed the depreciation rate displayed on the defaults page to be a blended average rate of all of the process equipment.
Revision 0802 - Added Toshiba die size projections for 43nm and 32nm die with 2, 3 and 4 bits per cell and 16Gb, 32Gb and 64Gb densities. Added 64Gb NAND Flash to the product type drop-down list. Added ASIC - high performance - very complex to the Product Type selections. Changed the equipment upgrade calculations to use a new improved algorithm and adjusted defaults appropriately. Put in target Fab for each company specific process, Fab names are displayed on the defaults page. Added comments on the '12 OH - IDL and Monitors' page explaining the calculations and how equipment fits in. Updated Samsung 40nm NAND Flash process and added 32 and 22nm NAND Flash processes. Added Samsung projected 40nm, 32nm and 22nm NAND Flash die sizes for 16Gb and 32Gb products. Added 450mm Samsung 22nm NAND Flash process.
Revision 0803 - adjusted transparent film thickness measurement usage. Updated Chartered 180nm and 130nm processes. Updated TSMC 130nm processes to fix a bug. Added TSMC 40nm processes. Added 90nm, 65nm and 45nm common platform processes for Chartered, IBM and Samsung. Added TSMC 250nm 3 layer aluminum process. Adjusted direct and indriect labor factors for 300mm. Added comments explaning cost categories to the '11 OH - Capital and Tool Maint', '12 OH - IDL and Monitor', '13 OH - facilities', and '14 OH - Consumables' worksheets.
Revision 0804 - restored TSMC and AMD - 200mm - 110nm processes. Added and updated Intel microprocessor die sizes.
Revision 0804a - adjusted Intel 45nm, 32nm and 22nm processes.

Cost and how to buy

1st copy price - $1,900 - SALE $1,700
2nd or 3rd copy price or 2007 to 2008 upgrade - $1,267 - SALE $1,133
4th copy - $1,013 - SALE $907
Enterprise license - $6,460 - SALE $5,780

You can order on-line or we accept purchase orders from most companies.

Related Products

IC Economics Report - a full color annual report covering IC Cost and Economics as well as the IC market, materials, capital costs, 300mm and 450mm wafers, design and operations. The IC Economics report is an excellent companion product to the IC Cost Model.