Fundamental Principles of Integrated Circuit Fabrication
Introduction
In 2000 we were developing a highly technical text book entitled "Fundamenatl Principles of Integrated Circuit Fabrication". We ultimately decided there wasn't a big enough market to complete the book. Posted here for our web site visitors use are the completed and mostly completed chapters.
Chapter list
- Chapter 1 - Properties of Silicon - complete chapter
- Chapter 2 - An Overview of Semiconductor Technology - complete chapter
- Chapter 3 - Pre Thermal or Deposition Process: Wafer Cleaning - partial chapter to be posted
- Chapter 4 - Thermal Oxidation and Nitridation of Silicon and Silicon Dioxide - partial chapter to be posted
- Chapter 5 - Photolithography - complete chapter
- Chapter 6 - Etching and Stripping - not written
- Chapter 7 - Diffusion in Silicon - complete chapter - updated April 25, 2008
- Chapter 8 - Ion Implantation and Annealing - not written
- Chapter 9 - Silicon, Polysilicon and Dielectric Deposition - not written
- Chapter 10 - Metal Deposition - not written
- Chapter 11 - Chemical Mechanical Planarization - not written
For a complete up-to-date treatement of Integrated Circuit Technology including teh latest process flows we recommend our IC Technology Report.
Related Products
- 2007 IC Technology Report - Buy now and get the 2008 report as a free upgrade. This report covers introductory material, process integration, unit steps and materials. Published April 2007, $1,000 for the full report. This report is written at an introductory to intermediate level. ORDER NOW!
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